Motek/Bondexpo 2023: Pragmatic, Highly Practical and Solutions-Oriented

The Motek/Bondexpo trade fair duo is ready to go: the manufacturing industry will meet in Stuttgart at the 41st Motek international trade fair for automation in production and assembly, together with the 16th Bondexpo international trade fair for bonding technology, from the 10th through the 13th of October, 2023. The traditional platform focuses on production as an overall system and presents future-proof solutions – from components and assemblies, right on up to subsystems and complete solutions.

Four full days of Motek/Bondexpo are a traditional highlight in the autumn trade fair calendar of the automation industry. Suppliers and users will meet face-to-face from 10 to 13 October in three exhibition halls in Stuttgart to discuss how current and future challenges can be mastered: international crises, climate change, the energy transition, rising costs, the shortage of skilled personnel – companies will have to respond to these complex tasks in a decisive manner in order to survive on the market. Special emphasis is placed on the importance of conserving resources and sustainability in industrial manufacturing, which will also be a focal point at Motek/Bondexpo. The time-tested trade fair duo covers the entire process sequence for economical production – from components and assemblies, right on up to subsystems and complete solutions – and approaches industrial production as a complete system.

One of the exhibitors’ primary topics is getting started easily with automation, whose role is growing steadily in the value chain for industrial manufacturing processes. Automation and the use of digital technologies are the basis for energy and resource-efficient processes. The trade fair programme focuses on three main areas: 1) smart, networked products for feeding, handling and assembly, for example grippers, handling systems, intelligent screwdriving technology, smart linear technology, smart drives and feed components, 2) assembly assistance systems for manual and semi-automatic workstations, assisted order picking, ergonomic and age-appropriate workstations, automated bin picking, co-working with cobots and automated parts staging and discharge, 3) solutions for easy implementation and commissioning including software, plug & play solutions, starter kits and simulations using digital twins.

Bonding technology has been playing a more and more significant role in product manufacturing for years. It’s the only joining technology that securely and durably joins nearly any material combination without compromising its unique properties. Bonding technology can be used to integrate additional functions such as thermal conductivity or protection against water, dust and vibration, thus increasing the service life of the respective product. Only with the help of bonding technologies are lightweight design and miniaturisation made possible, both of which contribute to the efficient use of energy and resources. Adhesive bonding is also an indispensable repair method and is thus especially valuable in terms of product service life and sustainability.

The Motek/Bondexpo trade fair duo portrays process competence for industrial production in all of its aspects. Even more ergonomics, greater flexibility and more cost-efficient processes are in demand to a greater extent than ever before. The range of topics presented at Motek/Bondexpo provides the manufacturing sector with all of the solutions it needs to work even more economically and efficiently. Expert visitors can discuss all of these requirements and complex matters face-to-face with the suppliers on an equal footing. Motek/Bondexpo has been offering an appropriate setting for this purpose in a convincing manner for decades thanks to its practical orientation and relevance. It’s a mirror image of modern, future-oriented industrial manufacturing and focuses on feasibility in everyday operations.

Motek/Bondexpo cordially invites interested trade fair visitors to attend world-class technical presentations at the exhibitor forum. Guests benefit from networking opportunities and an up-to-date transfer of knowledge on all trade fair days: https://www.motek-messe.de/en/trade-fair-program/. This year’s opening press conference on the first day of the event – 10 October 2023 beginning at 11:00 a.m. – will also attract numerous interested parties: renowned representatives from industry and research will speak about “Sustainable Assembly Processes” with a focus on, amongst other aspects, AI applications in selected joining and assembly processes.

Expert visitors get concrete answers to their questions at Motek/Bondexpo. Managing directors, purchasing agents, factory outfitters, developers, design engineers and R&D managers from various industries will connect with relevant contact persons for their specific needs. This time-tested trade fair duo is the ideal platform for investment decisions regarding system architecture, process design and the future security of industrial production processes, as exhibitors and trade visitors have been confirming for decades. The venue’s location which is unique throughout Europe – directly adjacent to Stuttgart International Airport, just off the motorway and ideally linked to local public transport – makes travelling to the Stuttgart Exhibition Centre easy and convenient. Expert visitors benefit from the outstanding location and can conveniently visit the fair on a single day. Opening hours for Motek/Bondexpo at Messepiazza 1, 70629 Stuttgart: Tuesday, Wednesday and Thursday from 9 a.m. to 5 p.m. and Friday from 9 a.m. to 4 p.m.

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Schall has developed successful business platforms with internationally recognised trade fairs for quality assurance (Control), optical technologies, components and systems (Optatec), stamping technology (Stanztec), automation in production and assembly (Motek), bonding technology (Bondexpo), plastics processing (Fakuma), sheet metal working (Blechexpo) and joining technology (Schweisstec). This has given rise to entirely new markets in various sectors, whose protagonists are distinguished by tremendous innovative strength, comprehensive systems competence and practical application solutions.